Climatic testing evaluates the structural integrity, material behavior, and functional performance of a product under different environmental conditions. The product is held in a controlled chamber for a defined period and exposed to temperature, humidity, and rapid temperature changes. The aim is to simulate, in the laboratory, the demanding conditions the product may face in real operating environments.
Climatic testing reveals whether a product:
- Loses performance at high temperatures
- Maintains its operability at low temperatures
- Suffers corrosion in humid environments
- Develops cracking or connection damage from sudden temperature changes
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In real life these products can face many different environmental conditions, from desert heat to freezing cold, from tropical humidity to sudden temperature changes.
Applied Standards
Climatic tests carried out by OTAM are performed safely on state-of-the-art equipment, with reference to the following national and international standards:
- MIL-STD-810G — Method 501.5 (High Temperature, Procedure I-II), Method 502.5 (Low Temperature, Procedure I-II), Method 503.5 (Temperature Shock), Method 507.5 (Humidity)
- MIL-STD-810G Change 1 — Method 501.6 (High Temperature, Procedure I-II), Method 502.6 (Low Temperature, Procedure I-II), Method 503.6 (Temperature Shock), Method 507.6 (Humidity)
- MIL-STD-810H — Method 501.7 (High Temperature, Procedure I-II), Method 502.7 (Low Temperature, Procedure I-II), Method 503.7 (Temperature Shock), Method 507.6 (Humidity)
- RTCA DO-160G
- ISO 16750-4
- EN 60068-2-53
Climatic tests are meticulously applied to prove that products in critical sectors such as defense, aerospace, and the automotive industry meet demanding environmental durability standards and to verify their performance.
Key Definitions in Climatic Testing
It is the rate at which temperature changes over time, generally expressed in °C/minute. High ramp rate values create sudden thermal stresses on the product.
It is a critical parameter especially in thermal shock and temperature cycling tests.
The rate at which temperature increases or decreases over time directly affects the level of thermal stress on the product.
- Low ramp rate → Smoother transition
- High ramp rate → Higher thermal stress
It is a critical parameter especially in temperature cycling and thermal shock testing.
It is the time the product is held at a defined temperature or humidity level. This time is required for the product’s internal temperature to reach the chamber temperature and stabilize. It is generally expressed in minutes or hours.
The time the product is held steady at the target temperature or humidity. This time is required for the product’s internal temperature to reach the chamber temperature.
When determining dwell time:
- Product thermal mass
- Dimensions
- Material structure
are taken into account.
It is the ratio of water vapor in the air to the maximum amount of water vapor the air can hold at the same temperature, expressed as a percentage (%). High relative humidity can increase the risk of corrosion and electrical leakage.
The time the product is held steady at the target temperature or humidity. This time is required for the product’s internal temperature to reach the chamber temperature.
When determining dwell time:
- Product thermal mass
- Dimensions
- Material structure
are taken into account.
These are internal stresses caused by the expansion or contraction of materials in response to temperature changes. Because different materials expand at different rates, damage can occur at connection points.
A single cycle in which a product transitions from low temperature to high temperature and back again. Repeating these cycles can cause material fatigue.
A product’s ability to maintain functional and structural integrity against temperature, humidity, and other environmental factors.
It is the temperature at which water vapor in the air begins to condense. When a surface temperature drops below the dew point, condensation forms.
This concept is critical especially in:
- Humidity tests
- Combined temperature-humidity tests
- Thermal transitions
because in electronic systems, condensation can lead to short circuits and corrosion.
The temperature at which condensation begins. When a surface temperature falls below the dew point, water vapor turns into liquid.
This parameter is critical especially in:
- Combined temperature-humidity tests
- Operational electronics testing
because condensation can lead to short circuits and corrosion.
The temperature difference between different points of a product. In large and complex products, internal and external surface temperatures can differ.
This:
- Increases internal stress
- Accelerates thermal fatigue
For this reason, sensor placement and dwell times must be planned correctly.
The temperature difference between different points of a product. In large or complex products, internal and external surface temperatures may not change at the same rate.
This can increase internal stresses and raise the risk of damage. Sensor placement is therefore important.
The time between the chamber reaching the set temperature/humidity value and the product’s internal temperature reaching the same value.
When defining test duration, it is not the chamber display alone but sensor readings on the product that should be considered.
After the chamber temperature reaches the target value, this is the time required for the product’s internal temperature to reach the same value.
In professional testing, decisions are made based on sensor measurements on the product, not just the chamber sensor.
The simulation of effects a product would experience over many years using high temperature and humidity conditions in a short time.
This approach is used for:
- Material life prediction
- Reliability assessment
In some climatic tests, the product is operated throughout the test and its performance parameters are continuously monitored.
This method helps detect:
- Temperature-related faults
- Humidity-induced leakage
- Unstable operation
In some tests, the product is operated during environmental exposure and performance parameters are monitored.
This way:
- Temperature-related faults
- Humidity-induced leakage
- Unstable operating conditions
can be detected.
In thermal shock tests, the time the product takes to transition between hot and cold zones. The shorter this time, the more severe the thermal stress on the product.